INCH - POUND
MIL-I-46865B(MI)
28 June 1991 SUPERSEDING MIL-I-46865A(MI)
8 August 1980
MILITARY SPECIFICATION
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION
This specification is approved for use by the U.S. Army Missile Command, Department of the Army, and is available for use by all Departments and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification covers an epoxy resin electrical insulating compound used for potting and encapsulating.
1.2 Classification. The epoxy resin shall be of the following types, as specified
(see 6.1 and 6.2):
Type I - Low viscosity Type II - Medium viscosity Type III - High viscosity
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, U.S. Army Missile Command, ATTN: AMSMI-RD-SE-TD-ST, Redstone Arsenal,
AL 35898-5270 by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.
AMSC N/A FSC 5970
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
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