MIL-P-47099 Polyurethane Foam, Polyether Type, Rigid, For Packaging And Encapsulation Of Electrical ComponentsThis specification covers the requirements and tests for three types of two-component polyether type polyurethane foam,rigid, for packaging and encapsulation of electronic components.

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MIL-P-47099A

Five specimens shall be prepared for tensile strength, compression strength, shear strength and dimensional stability tests.  One specimen shall be prepared for the remainder of the tests.  The foam compound used for preparing specimens shall be mixed and cured in accordance with the manufacturer's recommendations.  Specimens prepared for dimensional stability testing shall be four inches high and three inches in diameter.  All other specimens shall be prepared in accordance with he applicable test method.  No defects shall be allowed for dimensional stability or density tests.

4.7.2  Density.  The material shall be tested in accordance with ASTM D1622 for conformance to table I.

4.7.3  Tensile strength. The material shall be tested in accordance with ASTM D1623 for conformance to table I.

4.7.4  Compression strength. The material shall be tested in accordance with

ASTM D1621 for conformance to table I.

4.7.5  Shear strength. The material shall be tested in accordance with ASTM D732 for conformance to table I.

4.7.6  Dielectric constant. The material shall be tested in accordance with

ASTM D150 for conformance to table I.

4.7.7  Dielectric strength. The material shall be tested in accordance with

ASTM D149 for conformance to table I.

4.7.8  Dimensional stability.  The material shall be exposed to seven heat cycles in accordane with figure 1 to determine conformance to table I.

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