MIL-P-47099 Polyurethane Foam, Polyether Type, Rigid, For Packaging And Encapsulation Of Electrical ComponentsThis specification covers the requirements and tests for three types of two-component polyether type polyurethane foam,rigid, for packaging and encapsulation of electronic components.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12

MIL-P-47099A

    15 HR.          

+155°F

40% HUMIDITY

AMBIENT (ROOM)

+32°F

HUMIDITY NOT

CONTROLLED

-65°F                       

1.5 HR.                                   3 HR.      3 HR.                                                      1.5 HR.

24 HR.           

2  CYCLE

FIGURE 1.    Heat cycle for dimensional stability test.

4.7.9  Flammability.  The material shall be tested in accordance with

MIL-F-83671 for conformance to table I.

4.7.10  Temperature resistance.  The material shall be baked for a period which shall be not less than one hour at 86.9  ±  3°C(190  ±  5°F) for conformance to table I.

4.7.11  Humidity growth.  The material shall be tested in accordance with MIL- STD-810, Method 507, for conformance to table I.

4.7.12  Fungus resistance.  The material shall be tested in accordance with

MIL-STD-810, Method 508, for conformance to table I.

5.  PACKAGING

5.1  Preservation.  Preservation shall be levels A, B or C (see 6.2).

5.1.1  Level A.

5.1.1.1  Unit packs.  The polyether type polyurethane base resin and a separate isocyanate-type curing agent shall be unit packed in accordance with MIL-P-116, method IA-5.  The polyether type polyurethane base resin and the isocyanate-type

8