MIL-I-46865 Insulating Compound, Electrical, Epoxy, Colloidal Silica Filled For Potting And Encapsulation S/S By A-A-59134This specification covers an epoxy resin electrical insulating compound used for potting and encapsulating.

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MIL-I-46865B (MI)

6.4 Composition. Compounds which meet the requirements of this specification may be made from ingredients with the characteristics specified in table V.

TABLE V. Composition.

Characteristic

Epoxy resin

Amine Curing agent

Filler

Viscosity,

25°C, cP

55-100

10,000-16,000

Epoxide equivalent

305-335

175-210

Amine Value

63-67

Silicon dioxide after removal of volatiles, weight, percent

99.00

Specific surface area, ft2

16.26-20.90

Tap density,

25°C lbs/cu. ft

2.5-3.5

6.4.1 Description of compound ingredients. The compound ingredients are as follows:

(a) Epoxy resin I - A liquid epoxy, polyglycol, flexible when cured. (b) Epoxy resin II - A liquid epoxy, bisphenol A, rigid when cured. (c) Amine curing agent - A liquid aliphatic triamine.

(d) Filler - Colloidal silica.